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Plasma-Enhanced Chemical Vapor Deposition of Two-Dimensional Materials for Applications

期刊

ACCOUNTS OF CHEMICAL RESEARCH
卷 54, 期 4, 页码 1011-1022

出版社

AMER CHEMICAL SOC
DOI: 10.1021/acs.accounts.0c00757

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资金

  1. Shanghai Committee of Science and Technology in China [18ZR1404900]
  2. National Natural Science Foundation of China [51773041, 61890940, 21603038]
  3. National Key RAMP
  4. D Program of China [2018YFA0703200]
  5. Strategic Priority Research Program of the Chinese Academy of Sciences [XDB30000000]
  6. Fudan University

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Mechanical exfoliation, solution synthesis, and CVD are common methods for preparing 2D materials, among which PECVD is an important catalyst-free, low-temperature in situ preparation method with high controllability. Significant progress has been made in using PECVD to prepare 2D materials with different morphologies and properties.
Since the rise of two-dimensional (2D) materials, synthetic methods including mechanical exfoliation, solution synthesis, and chemical vapor deposition (CVD) have been developed. Mechanical exfoliation prepares randomly shaped materials with small size. Solution synthesis introduces impurities that degrade the performances. CVD is the most successful one for low-cost scalable preparation. However, when it comes to practical applications, disadvantages such as high operating temperature (similar to 1000 degrees C), probable usage of metal catalysts, contamination, defects, and interstices introduced by postgrowth transfer are not negligible. These are the reasons why plasma-enhanced CVD (PECVD), a method that enables catalyst-free in situ preparation at low temperature, is imperatively desirable. In this Account, we summarize our recent progress on controllable preparation of 2D materials by PECVD and their applications. We found that there was a competition between etching and nucleation and deposition in PECVD, making it highly controllable to obtain desired materials. Under different equilibrium states of the competition, various 2D materials with diverse morphologies and properties were prepared including pristine or nitrogen-doped graphene crystals, graphene quantum dots, graphene nanowalls, hexagonal boron nitride (hBN), B-C-N ternary materials (BCxN), etc. We also used mild plasma to modify or treat 2D materials (e.g., WSe2) for desired properties. PECVD has advantages such as low temperature, transfer-free process, and industrial compatibility, which enable facile, scalable, and low-cost preparation of 2D materials with clean surfaces and interfaces directly on noncatalytic substrates. These merits significantly benefit the as-prepared materials in the applications. Field-effect transistors with high motilities were directly fabricated on graphene and nitrogen-doped graphene. By use of h-BN as the dielectric interfacial layer, both mobilities and saturated power densities of the devices were improved owing to the clean, dosely contacted interface and enhanced interfacial thermal dissipation. High-quality materials and interfaces also enabled promising applications of these materials in photodetectors, pressure sensors, biochemical sensors, electronic skins, Raman enhancement, etc. To demonstrate the commercial applications, several prototypical devices were studied such as distributed pressure sensor arrays, touching module on a robot hand for braille recognition, and smart gloves for recording sign language. Finally, we discuss opportunities and challenges of PECVD as a comprehensive preparation methodology of 2D materials for future applications beyond traditional CVD.

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