4.7 Article

Simple fabrication of highly sensitive capacitive pressure sensors using a porous dielectric layer with cone-shaped patterns

期刊

MATERIALS & DESIGN
卷 197, 期 -, 页码 -

出版社

ELSEVIER SCI LTD
DOI: 10.1016/j.matdes.2020.109203

关键词

Polydimethylsiloxane; Porous structures; Capacitive pressure sensors; Wearable electronics

资金

  1. National Research Foundation of Korea (NRF) - Korea Government (MSIP) [2019R1A2C1005023]
  2. Hanyang University [HY-2020-0389]

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This study aimed to increase the sensitivity of sensors by utilizing porous structures and cone-shaped patterns in the composition of a capacitive pressure sensor. A simple and rapid fabrication method using microwave irradiation was introduced, showing improvements in sensitivity and performance for wearable devices, artificial skin, surgical robots, and pressure monitoring systems.
This study aims to improve the sensitivity of sensors using porous structures and cone-shaped patterns in the composition of a capacitive pressure sensor. A simple and rapid fabrication method for the production of porous structures and cone-shaped patterns using microwave irradiation of emulsions containing polydimethylsiloxane (PDMS) and a sacrificial solvent is introduced in this study. Through this method, a porous PDMS dielectric layer could be simply fabricated within a few minutes. The sensitivity was greatly improved by both enhancing deformability and increasing the dielectric constant under the external pressure. The effect of pattern distance was investigated, and the sensor with the pattern distance of 600 mu m showed a remarkably high sensitivity of approximately 5 kPa(-1). Moreover, the effect of aspect ratio and sharpness of the patterns were also studied through a finite element analysis. Finally, we demonstrated the performance of the sensor using a sensor array and finger attached sensors, and they showed sufficient performance for use in wearable devices applicable to artificial skin, surgical robots, and pressure monitoring systems, among others. (C) 2020 The Authors. Published by Elsevier Ltd.

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