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A review on recent progress in the development of photoelectrodes for photocathodic protection: Design, properties, and prospects

期刊

MATERIALS & DESIGN
卷 197, 期 -, 页码 -

出版社

ELSEVIER SCI LTD
DOI: 10.1016/j.matdes.2020.109235

关键词

Photocathodic protection; TiO2 photoelectrodes; Photoelectrochemical performance; Photoelectron storage; In-situ protection

资金

  1. Fundamental Research Funds for the Central Universities of China [buctrc201730]

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Metal corrosion is a persistent challenge, and the use of PCP technology for anti-corrosion has gained attention in the past decade due to its green and sustainable properties. The focus is on designing and preparing efficient photoelectrode materials.
Metal corrosion is a long-term challenge facing mankind. Thanks to its green, environmentally friendly, sustainable properties, photocathodic protection (PCP) technology have become hot research for metal anti-corrosion in the past decade. In this technology, an n-type semiconductor as an electron donor (photoanode) to provide continuously injected photoelectrons to the metal substrate (cathode), causing negative shift self-corrosion potential to achieve anti-corrosion. Therefore, the design and preparation of highly efficient photoelectrode materials is currently an urgent research topic. Herein, we reviewed the most common strategy used in the preparation and modification of highly efficient photoelectrodes, discussed how to design highly efficient and functional photoelectrodes in detail, and highlighted some examples of photoelectrodes with unique and impressive properties. Then, some potential novel functional materials, energy storage mechanism and in-situ protection technology were reviewed to equip the readers with the latest research trends. Finally, we discuss the outlook and remaining challenges practical in the field of PCP industrial-scale application. (c) 2020 The Authors. Published by Elsevier Ltd. This is an open access article under the CC BY-NC-ND license (http:// creativecommons.org/licenses/by-nc-nd/4.0/).

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