4.7 Article

Fused Filament Deposition of PLA: The Role of Interlayer Adhesion in the Mechanical Performances

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POLYMERS
卷 13, 期 3, 页码 -

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MDPI
DOI: 10.3390/polym13030399

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additive manufacturing; polymer crystallization; solidification modeling; molecular diffusion

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A set of criteria for enhancing mechanical performances of PLA standard specimens were proposed by adjusting the temperature field during fused PLA deposition. Temperature was found to have a significant impact on the morphology and mechanical characteristics of the specimens, especially on interlayer adhesion and molecular diffusion. A mathematical model was introduced to simulate temperature evolution, which proved consistent with experimental results, showing a relationship with mechanical performances, morphology, and molecular weight between entanglements of the parts.
A set of criteria to enhance mechanical performances of standard specimens (Type V, ANSI D368) made of polylactic acid (PLA) were proposed. Fused PLA deposition was conducted with nozzle temperature ranging from 180 to 230 degrees C and deposition plate temperature ranging from 70 to 110 degrees C. Optical microscopy, elastic modulus analysis and density measurement allowed emphasizing the effect of temperature field, also measured during the process, on the morphology and the mechanical characteristics of the specimen. Atomic force microscopy revealed a morphology typical of amorphous samples with globular structures. Poor interlayer adhesion was detected in the part of the specimen located at larger distance from the deposition plate, showing an elastic modulus lower than those measured in the central part (220 MPa vs. 500 MPa). The specimen crystallinity degree was below 3%. The molecular weight between entanglements was adopted as a measure of the interlayer molecular diffusion. A successful diffusion and re-entanglement of the polymer melt at the interface was the key to improving mechanical performance. A mathematical model describing the transient heat transfer during the fused PLA deposition and accounting for solidification and the nonisothermal crystallization kinetics was introduced. Simulated temperature evolutions were consistent with the experimental ones. They were related to the mechanical performances, the morphology, and the molecular weight between entanglements of the parts.

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