4.7 Article

Temperature-Triggered/Switchable Thermal Conductivity of Epoxy Resins

期刊

POLYMERS
卷 13, 期 1, 页码 -

出版社

MDPI
DOI: 10.3390/polym13010065

关键词

epoxy resin; crosslinked polymer; thermal conductivity; inorganic filler; pi-pi stacking; polymer from natural resources; bisphenol-free epoxy resin

资金

  1. K-Project 'PolyTherm' at the Polymer Competence Center Leoben GmbH (PCCL, Austria) within the framework of the COMETprogram of the Federal Ministry for Climate Action, Environment, Energy, Mobility, Innovation, and Technology
  2. Federal Ministry for Digital and Economic Affairs
  3. Graz University of Technology
  4. Institute of Electron Microscopy and Nanoanalysis of the TU Graz
  5. Graz Centre for Electron Microscopy
  6. Austrian Government
  7. State Government of Styria

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This study explores and compares two strategies - compounding with thermally conductive inorganic materials and blending with aromatic units arranged by the principle of pi-pi stacking - to increase the thermal conductivity of epoxy-amine resins. It was found that enhanced thermal conductivity was observed exclusively in DEO-based polymer networks, attributed to the higher flexibility of the aliphatic carbon chain of DEO compared with BADGE.
The pronouncedly low thermal conductivity of polymers in the range of 0.1-0.2 W m(-1) K-1 is a limiting factor for their application as an insulating layer in microelectronics that exhibit continuously higher power-to-volume ratios. Two strategies can be applied to increase the thermal conductivity of polymers; that is, compounding with thermally conductive inorganic materials as well as blending with aromatic units arranged by the principle of pi-pi stacking. In this study, both strategies were investigated and compared on the example of epoxy-amine resins of bisphenol A diglycidyl ether (BADGE) and 1,2,7,8-diepoxyoctane (DEO), respectively. These two diepoxy compounds were cured with mixtures of the diamines isophorone diamine (IPDA) and o-dianisidine (DAN). The epoxy-amine resins were cured without filler and with 5 wt.-% of SiO2 nanoparticles. Enhanced thermal conductivity in the range of 0.4 W.m(-1).K-1 was observed exclusively in DEO-based polymer networks that were cured with DAN (and do not contain SiO2 fillers). This observation is argued to originate from pi-pi stacking of the aromatic units of DAN enabled by the higher flexibility of the aliphatic carbon chain of DEO compared with that of BADGE. The enhanced thermal conductivity occurs only at temperatures above the glass-transition point and only if no inorganic fillers, which disrupt the pi-pi stacking of the aromatic groups, are present. In summary, it can be argued that the bisphenol-free epoxy-amine resin with an epoxy compound derivable from natural resources shows favorably higher thermal conductivity in comparison with the petrol-based bisphenol-based epoxy/amine resins.

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