期刊
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY
卷 10, 期 12, 页码 1960-1964出版社
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/TCPMT.2020.3038113
关键词
Light emitting diodes; Silicon; Reliability; Nanoparticles; Aluminum oxide; Packaging; Encapsulation; Al₂ O₃ nanoparticles (NPs); reliability; UV-curing encapsulant
类别
资金
- Science and Technology Project of Guangdong Province, China [2017B090911002]
- Science and Technology Planning Project of Guangzhou, China [201804020051]
- Open Fund of the State Key Laboratory of Optoelectronic Materials and Technologies (Sun Yat-sen University)
Silicone-based UV curing has recently been developed as a novel kind of encapsulation technology, which is time-saving and cost-effective for the package of light-emitting diodes (LEDs). In this work, to improve the light output power (LOP) and device reliability of LEDs packaged by UV curing, Al2O3 nanoparticles (NPs) are doped into silicone. Different compositions of Al2O3 NPs are used and the optimal composition is found to be 0.3%. Compared with LEDs packaged by UV curing without Al2O3 doping (256.3 mW) and by traditional thermal-curing (264.1 mW) encapsulants, the LOP is increased to 272.9 mW for LED with Al2O3-NP-doped encapsulant. The enhancement of LOP is attributed to both the increased refractive index and light scattering effect of the Al2O3 NPs, which improves the light extraction efficiency (LEE) of the encapsulant. Furthermore, the improvement of LEE also suppresses the heat generation and thus improving the long-term reliability of the devices. These results indicate that using high refractive index materials as doping, UV curing could be an excellent choice as a novel package technology for the LED industry.
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