Simulation research of high-efficiency unidirectional vertical coupling grating couplers for optical through-silicon vias in 3D optoelectronic integrated circuits

A unidirectional vertical coupling structure is designed based on optical through-silicon vias (TSVs) and gratings to couple and steer the optical interconnects in 3D optoelectronic integrated circuits. The optical TSVs provide high-speed vertical optical data transmission over short distances. The grating coupler structure achieves efficient coupling between an optical TSV and a planar Si waveguide. Through the action of a mirror that covered the end of the optical TSV cladding and a distributed Bragg reflector(DBR) positioned on the far side away from the waveguide, coupling efficiency of 80% at 1550 nm is obtained in simulations. Our proposed vertical coupling structure represents a high-efficiency solution for 3D optical interconnects and can play an important role in 3D optoelectronic integrated circuits.

Automated summary

A unidirectional vertical coupling structure based on optical TSVs and gratings is proposed for efficient optical interconnects in 3D optoelectronic integrated circuits. The structure achieves high coupling efficiency through the use of a mirror and a DBR, suitable for high-speed vertical optical data transmission over short distances.