期刊
OPTICS AND LASER TECHNOLOGY
卷 132, 期 -, 页码 -出版社
ELSEVIER SCI LTD
DOI: 10.1016/j.optlastec.2020.106472
关键词
Femtosecond laser; Sapphire; High aspect ratio; Laser ablation; Transparent materials; Crack free
资金
- Agency for Science, Technology and Research, RIE2020 Advanced Manufacturing and Engineering Individual Research Grant [A1883c0010]
- National Engineering Research Center for Optoelectronic Crystalline Materials, Fujian Institute of Research on the Structure of Matter, Chinese Academy of Sciences
We report a novel laser processing strategy to realize high-aspect-ratio crack-free microstructures fabrication on sapphire substrates by combining femtosecond laser-induced plasma-assisted ablation and subsequent direct laser ablation. The laser-induced plasma assisted ablation allows us to create a precursor for microstructure generation on smooth sapphire at a low laser fluence. Then we demonstrate a precise control of the direct laser ablation operating at a critical fluence to deepen the previous microstructures. The precise control and optimization of the processing parameters are able to effectively reduce laser heating and avoid crack formation inside the substrate. Crack-free and taper-free micro-grooves are achieved on sapphire with a maximum high aspect-ratio up to 10:1. The capability of this method to fabricate a variety of functional microstructures is also experimentally demonstrated.
作者
我是这篇论文的作者
点击您的名字以认领此论文并将其添加到您的个人资料中。
推荐
暂无数据