期刊
LANGMUIR
卷 37, 期 5, 页码 1874-1881出版社
AMER CHEMICAL SOC
DOI: 10.1021/acs.langmuir.0c03319
关键词
-
资金
- Engineering Research Centers Program of the National Science Foundation [EEC-1647837]
In the past three decades, research in tissue engineering and organic electronics has seen significant growth, offering potential for innovation and translation if adapted to pattern biological materials. The study demonstrates that biocompatible organic small-molecule materials can pattern cells at the microscale, utilizing techniques widely used in electronic device fabrication. The interaction between the two fields, although limited, shows promising results in promoting cell adhesion and demonstrating reproducibility in fabrication processes.
Over the past 3 decades, there has been a vast expansion of research in both tissue engineering and organic electronics. Although the two fields have interacted little, the materials and fabrication technologies which have accompanied the rise of organic electronics offer the potential for innovation and translation if appropriately adapted to pattern biological materials for tissue engineering. In this work, we use two organic electronic materials as adhesion points on a biocompatible poly(p-xylylene) surface. The organic electronic materials are precisely deposited via vacuum thermal evaporation and organic vapor jet printing, the proven, scalable processes used in the manufacture of organic electronic devices. The small molecular-weight organics prevent the subsequent growth of antifouling polyethylene glycol methacrylate polymer brushes that grow within the interstices between the molecular patches, rendering these background areas both protein and cell resistant. Last, fibronectin attaches to the molecular patches, allowing for the selective adhesion of fibroblasts. The process is simple, reproducible, and promotes a high yield of cell attachment to the targeted sites, demonstrating that biocompatible organic small-molecule materials can pattern cells at the microscale, utilizing techniques widely used in electronic device fabrication.
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