期刊
JOURNAL OF NANOMATERIALS
卷 2020, 期 -, 页码 -出版社
HINDAWI LTD
DOI: 10.1155/2020/8843166
关键词
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资金
- Natural Science Foundation [202300410272, 202300410268]
- China Ministry of Education [201901078004, 201901078022]
- Open Fund of National Joint Engineering Research Center for Abrasion Control and Molding of Metal Materials [HKDNM2019020]
- National Natural Science Foundation of China [51705151, 52071165]
- China Postdoctoral Science Foundation [2019M662011]
- Open Fund of State Key Laboratory of Advanced Brazing Filler Metals and Technology [SKLABFMT201901]
- Open Fund of State Key Laboratory of Advanced Welding and Joining [AWJ-21M11]
- Key Technology Needs of Henan Province Unveiled and Solved Project [191110111000]
With the miniaturization of solder joints and deterioration of serving environment, much effort had been taken to improve the properties of Sn-based lead-free solders. And the fabrication of Sn-based lead-free composite solder alloys by the addition of nanoparticles is one of the effective ways to enhance the properties. In this paper, the recent research progress on the Sn-based lead-free composite solder alloys is reviewed by summarizing the relevant results in representative ones of Sn-Ag-Cu (SAC), Sn-Bi, and other multielement lead-free composite solder alloys. Specifically speaking, the effect of the added nanoparticles on the evolution of wettability, microstructure morphology, and mechanical properties of Sn-based lead-free composite solder alloys are summarized. It is hoped that this paper could supply some beneficial suggestions in developing the novel Sn-based lead-free composite solder alloys. Additionally, the existed issues and future development trends in the exploitation of new novel Sn-based lead-free composite solder alloys are proposed.
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