期刊
JOURNAL OF ELECTRONIC MATERIALS
卷 50, 期 2, 页码 664-674出版社
SPRINGER
DOI: 10.1007/s11664-020-08607-8
关键词
Soft-magnetic composite; insulation coating; magnetic property; eddy-current loss
资金
- Korean Government (SMBA) [10050459]
- Korea Evaluation Institute of Industrial Technology (KEIT) [10050459] Funding Source: Korea Institute of Science & Technology Information (KISTI), National Science & Technology Information Service (NTIS)
A high-performance soft-magnetic composite (SMC) was successfully fabricated without the application of compaction pressure by mixing three different alumina-coated Fe-based metal powders and molding in a toroidal mold. The optimal magnetic properties were achieved through surface coating control and an effective mixture of metal powders.
A high-performance soft-magnetic composite (SMC) has been successfully fabricated in a toroidal mold without the application of compaction pressure by mixing three different alumina-coated Fe-based metal powders, namely carbonyl iron (FM), Fe-Si-Cr alloy (FSC), and Fe-Si-Al alloy (sendust), with epoxy resin in a centrifugal paste mixer. Surface coating with an alumina layer was performed via a sol-gel process, and its thickness was controlled by varying the coating time. Without the alumina coating, the SMC toroidal core with a FM:FSC:sendust mixing ratio of 8:22:70 by mass exhibited optimal magnetic properties including an effective permeability (mu(eff)) of 33.9 and total core loss (P-t) of 252 mW/cm(3) at 100 kHz with an amplitude (B) of 50 mT. With the alumina coating, however, the SMC toroidal core with the same mixing ratio exhibited a significantly reduced P-t value of 213 mW/cm(3) while its mu(eff) value was slightly decreased to 32.4, primarily due to the suppression of the macroscopic eddy-current loss from 115 mW/cm(3) to 85 mW/cm(3). These results indicate that an optimal mixture of the three different alumina-coated Fe-based metal powders is very effective for fabricating high-performance SMC cores without external pressure for molding, being applicable for miniature electronic components.
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