PEG-filled kapok fiber/sodium alginate aerogel loaded phase change composite material with high thermal conductivity and excellent shape stability

Phase change materials (PCMs) need to improve thermal conductivity and maintain stability to meet actual application requirements. Here, a novel composite based on hydroxylated boron nitride (BN-OH) as a thermally conductive filler with superior thermal energy storage and shape stability is reported. By combining kapok fiber (KF) and sodium alginate (SA), lightweight KF/SA aemgels were fabricated, and their highly porous but durable three-dimensional networks benefit the encapsulation of polyethylene glycol (PEG) and prevent the leakage of PEG. PCMs are prepared by vacuum-assisted impregnating of PEG into the aerogels. The thermal conductivity of 0.684 W.m(-1).K-1 at 10 wt% BN-OH is greatly improved because hydroxyl groups cannot only reduce interfacial thermal resistance but form secure thermal conductive networks. In addition, this novel PCMs possesses excellent shape stability and high latent heat of fusion, and the PCMs keep their shapes stable without any leakage even is compressed upon the melting point of PEG.

Automated summary

A novel composite based on hydroxylated boron nitride was reported for improving thermal conductivity and stability of PCMs. The composite, combined with kapok fiber and sodium alginate, demonstrated enhanced thermal conductivity and shape stability for PCMs.