Effect of substrate tilt on sputter-deposited AuTa films

Gold-tantalum alloy films are of interest for biomedical and magnetically-assisted inertial confinement fusion applications. However, growth mechanisms of such Au-Ta alloy films are not well understood. Here, we systematically study the effect of substrate tilt on properties of films deposited by direct current magnetron sputtering from a AuTa alloy target. Experimental data is correlated with distributions of landing energies and incident angles of sputtered and backscattered species calculated by Monte Carlo simulations of ballistic collisions and gas phase atomic transport. Results reveal that the deposition rate and film density monotonically decrease with increasing substrate tilt. Properties are similar for films with a tilt of 40. and below: films are amorphous, with an average compressive stress of 0.5 GPa, a density of 16 g/cm(3), and electrical resistivity of 200 mu Omega cm. The critical substrate tilt angle for the onset of porosity, a transition to a reduced stress state, and an increase in electrical resistivity lies between 40 and 60 degrees. Based on Monte Carlo simulations, these changes in film properties are correlated with an increase in the average impact angle of the ballistic component of atomic flux. Implications of these results to deposition onto non-planar substrates are discussed.

Automated summary

The study investigated the effects of substrate tilt on properties of gold-tantalum alloy films deposited by magnetron sputtering. It was found that the deposition rate and film density decrease with increasing substrate tilt angle, leading to changes in film properties such as porosity and electrical resistivity. The critical tilt angle for increased resistivity was determined to be between 40 and 60 degrees.