4.7 Article

High-temperature shape memory alloys based on the Cu-Al-Ni system: design and thermomechanical characterization

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出版社

ELSEVIER
DOI: 10.1016/j.jmrt.2020.07.002

关键词

Intermetallics; Shape memory alloys; Phase transitions; Superelasticity; Mechanical properties

资金

  1. Spanish Ministry of Economy and Competitiveness, MINECO [MAT2012-36421, MAT2017-84069P]
  2. ELKARTEK-ACTIMAT project from the Industry Department of the Basque Government
  3. University of the Basque Country, UPV/EHU [GIU-17/071, ESPDOC18/037]

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To offer a response to the increasing interest on high-temperature shape memory alloys, mainly driven by the aeronautic and aerospace industries, the design and characterization of Cu-Al-Ni shape memory alloys with high transformation temperatures, between 373 K and 473 K, are approached. The present alloy design is based on the transformation from cubic beta(3) austenite to the monoclinic beta'(3) martensite, which offers the advantage of exhibiting not only higher transformation temperatures but also a thermal hysteresis of about 12 K, much smaller than the orthorhombic gamma'(3) martensite historically considered for this alloy system. The influence of the alloy concentration and the thermal treatments, on the martensitic transformation temperatures is systematically analyzed and a quantitative and predictive equation is proposed. The influence of the stress on the transformation was also studied under two experimental conditions: at constant stress as a function of temperature (shape memory effect) and at constant temperature as a function of the stress (superelastic effect). A double stress-induced transformation from beta(3) to beta'(3) and alpha'(3) with an outstanding reversible and reproducible 24% superelastic strain is also reported. The experimental results allows also determine the Clausius-Clapeyron diagrams for this series of alloys, as a fundamental tool for further design of sensing and actuating devices based on these high-temperature shape memory alloys. (C) 2020 The Authors. Published by Elsevier B.V.

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