Low-temperature in-situ grown mullite whiskers toughened heat-resistant inorganic adhesive

The temperature required for growth of mullite whiskers in heat-resistant adhesive was decreased to 700 degrees C based on solid-liquid-solid (S-L-S) mechanism. The bonding strength was increased by 23.1% (700 degrees C) similar to 60.7% (1200 degrees C), and the maximal 32.3 MPa was achieved after sintered at 1200 degrees C. Moreover, the whiskers-grown adhesive also displayed better anti-damage capacity, and multiple grading fractures occurred during the test procedure, which was mainly due to the pull-out mechanism. (C) 2020 Elsevier B.V. All rights reserved.