期刊
JOURNAL OF ALLOYS AND COMPOUNDS
卷 836, 期 -, 页码 -出版社
ELSEVIER SCIENCE SA
DOI: 10.1016/j.jallcom.2020.155349
关键词
Heat-resistant adhesive; Mullite whiskers; In-situ; Lower temperature grow; S-L-S mechanism
资金
- National Natural Science Foundation of China [51802343, 51772326, 51672187]
- Scientific Research Project of Tianjin municipal Education Commission [2019ZD19]
- Fundamental Research Funds for the Central Universities [3122019161]
The temperature required for growth of mullite whiskers in heat-resistant adhesive was decreased to 700 degrees C based on solid-liquid-solid (S-L-S) mechanism. The bonding strength was increased by 23.1% (700 degrees C) similar to 60.7% (1200 degrees C), and the maximal 32.3 MPa was achieved after sintered at 1200 degrees C. Moreover, the whiskers-grown adhesive also displayed better anti-damage capacity, and multiple grading fractures occurred during the test procedure, which was mainly due to the pull-out mechanism. (C) 2020 Elsevier B.V. All rights reserved.
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