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Vertical beta-Ga2O3 Power Transistors: A Review

期刊

IEEE TRANSACTIONS ON ELECTRON DEVICES
卷 67, 期 10, 页码 3925-3937

出版社

IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/TED.2020.3016609

关键词

Breakdown; current aperture; current blocking layer (CBL); depletion mode (D-mode); drain-induced barrier lowering (DIBL); enhancement mode (E-mode); FinFET; Ga2O3; gallium oxide; halide vapor phase epitaxy (HVPE); interface trap; ion implantation; power transistor; vertical metal-oxide-semiconductor field-effect transistor (MOSFET); wide bandgap

资金

  1. Council for Science, Technology and Innovation (CSTI), Cross-ministerial Strategic Innovation Promotion Program (SIP), Next-generation power electronics (New Energy and Industrial Technology Development Organization)

向作者/读者索取更多资源

With projected performance advantages over silicon and incumbent wide-bandgap compound semiconductors, gallium oxide (Ga2O3) has garnered worldwide attention as an ultrawide-bandgap semiconductor material suitable for high-voltage, high-temperature, and radiation-hard electronics. Thanks to recent breakthroughs in crystal growth and device processing technologies, the research and development of vertically oriented Ga2O3 power transistors has made rapid strides. In this article, we review the important engineering achievements and performance milestones of the two major types of vertical Ga2O3 transistors-current aperture vertical metal-oxide-semiconductor field-effect transistors (MOSFETs) and vertical fin-channel MOSFETs. Challenges underlying the unique processing approaches to these devices and their implications on device reliability are also discussed.

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