4.6 Article

Enhancing Luminous Efficiency of Quantum Dot-Based Chip-on-Board Light-Emitting Diodes Using Polystyrene Fiber Mats

期刊

IEEE TRANSACTIONS ON ELECTRON DEVICES
卷 67, 期 10, 页码 4530-4533

出版社

IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/TED.2020.3014061

关键词

Chip-on-board light-emitting diodes (COB LEDs); luminous efficiency (LE); polystyrene (PS) fiber mats; quantum dots (QDs)

资金

  1. National Natural Science Foundation of China [51735004, 51775199]
  2. Natural Science Foundation of Guangdong Province [2018B030306008]
  3. Fundamental Research Funds for the Central Universities
  4. China Postdoctoral Science Foundation [2020M672618]

向作者/读者索取更多资源

Even though chip-on-board light-emitting diodes (COB LEDs) with quantum dots (QDs) are attracting much attention for their high optical performance, their luminous efficiency (LE) is still low owing to total internal reflection. To overcome this problem, in this study, a microfiber-silicone hybrid (MFSH) structure is proposed to enhance the LE of QD-based COB LEDs. Polystyrene (PS) fiber films were fabricated by electrospinning and subjected to planar compression modeling to precisely control their film thickness. Subsequently, these films were coated with silicone to finish packaging the COB LEDs. Their diffuse reflectance of the MFSH structures before and after silicone resin encapsulation was analyzed, witnessing a diffuse reflectance at 450 nm of 97.7% when the pure fiber-film thickness increases to 220 mu m. While applying to COB LEDs, the light output power of devices with MFSH structure increases first and then decreases, causing by the balance of light extraction by the scattering fiber and absorption by the difference between chip height and fiber film thickness. Finally, to increase the light-extraction capacity of COB LEDs, the thickness of the microfiber films was optimized to 25 mu m at which their LE increased by 29.7% and 31.7% for the blue LED source and QD-based COB LED source, respectively. Therefore, the MFSH structure is an effective packaging method to produce highly efficient COB LEDs.

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