4.7 Article

Grain refinement and weak-textured structures based on the dynamic recrystallization of Mg-9.80Gd-3.78Y-1.12Sm-0.48Zr alloy

期刊

JOURNAL OF MAGNESIUM AND ALLOYS
卷 9, 期 2, 页码 456-466

出版社

KEAI PUBLISHING LTD
DOI: 10.1016/j.jma.2020.06.001

关键词

Magnesium-rare earth (Mg-Re) alloy; Grain refinement; Discontinuous dynamic recrystallization (DDRX); Continuous dynamic recrystallization (CDRX); Hot indirect extrusion

资金

  1. National Natural Science Foundation of China [51571084, 18K14024]
  2. China Scholarship Council [201908410208]

向作者/读者索取更多资源

By utilizing dynamic recrystallization mechanisms during hot indirect extrusion, grain refinement in the magnesium-rare earth alloy was successfully achieved, especially through the formation of high angle grain boundaries to promote the generation of new grain nuclei, improving the efficiency of dynamic recrystallization.
We utilized electron backscatter diffraction to investigate the microstructure evolutions of a newly developed magnesium-rare earth alloy (Mg-9.80Gd-3.78Y-1.12Sm-0.48Zr) during instantaneous hot indirect extrusion. An equiaxed fine-grained (average grain size of 3.4 +/- 0.2 mu m) microstructure with a weak texture was obtained. The grain refinement was mainly attributed to the discontinuous dynamic recrystallization (DDRX) and continuous DRX (CDRX) processes during the hot indirect extrusion process. The twin boundaries formed during the initial deformation stage effectively increased the number of high angle grain boundaries (HAGBs), which provided sites for new grain nuclei, and hence, resulted in an improved DDRX process. Along with DDRX, CDRX processes characterized by low angle grain boundary (LAGB) networks were also observed in the grain interior due to effective dynamic recovery (DRV) at a relatively high temperature of 773 K and high strain rates. Thereafter, LAGB networks were transformed into HAGB networks by the progressive rotation of subgrains during the CDRX process. (C) 2020 Chongqing University. Publishing services provided by Elsevier B.V. on behalf of KeAi Communications Co. Ltd.

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