期刊
COATINGS
卷 10, 期 7, 页码 -出版社
MDPI
DOI: 10.3390/coatings10070647
关键词
TiC; Si substrate; epitaxial growth; reactive magnetron sputtering
资金
- Ministry of Science and Technology Taiwan, R.O.C. [MOST 107-2221-E-009-009-MY2, 108-2221-E-492-017, 108-2622-E-492-029-CC3]
Epitaxial (100) TiC film deposition on Si (100) substrate by direct current magnetron reactive sputtering of a metallic Ti target with 3%-6% CH4 in Ar gas was investigated. X-ray diffraction and cross-sectional scanning transmission electron microscopy (STEM) reveal that epitaxial cubic TiC can be grown on the Si substrate by domain matching epitaxy in 5/4 ratio with the epitaxial relationship of TiC (100)[0 (1) over bar1] // Si (100)[0 (1) over bar 1]. For sputtering with 3% and 4% CH4, the deposited films are found to consist of both TiC and metallic Ti phases. Increasing the CH4 flow ratio to 5% results in a deposited film completely consisting of TiC without metallic Ti phase. The crystallinity of the deposited TiC is also improved with increasing the CH4 ratio to 5%. X-ray photoelectron spectroscopy shows that the [C]/[Ti] atomic ratio in TiC is nearly close to 1 for growth with 5% CH4 flow ratio and above. The measured electrical resistivities of the deposited films also increase from 41 to 153 mu omega center dot cm with increasing the CH4 ratio from 3% to 6%. With film growth beyond 50 nm thickness, it is shown that some disoriented TiC grains are formed.
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