期刊
MATERIALS RESEARCH LETTERS
卷 8, 期 12, 页码 446-453出版社
TAYLOR & FRANCIS INC
DOI: 10.1080/21663831.2020.1799447
关键词
Computational interface design; high-throughput calculations; nanoprecipitate stabilization; creep resistance
资金
- National Natural Science Foundation of China [51621063, 51625103, 51722104, 51790482, 51771036, 51871033]
- 111 Project of China [BP2018008]
- NSFC [U1930402]
- Venture AMP
- Innovation Support Program for Chongqing Overseas Returnees [cx2018002]
- Australian Research Council
We demonstrate a strategy to stabilize nanoprecipitates in Al-Cu alloys, based on computational design that identifies synergistic solutes (Sc and Fe) that simultaneously segregate to the theta '-Al2Cu/Al interface and strongly bond to one another. Furthermore, Sc and Fe are predicted to each segregate into a separate atomic plane, forming a sandwiched structure reinforcing the interface. This interfacial architecture was realized through a simple heat treatment in a Sc-Fe-Si triple-microalloyed Al-Cu model alloy. Such a back-to-back layered interface, thermodynamically stable and kinetically robust, is found to suffocate nanoprecipitate coarsening at 300 degrees C, enabling a dramatic reduction in creep rate. IMPACT STATEMENT The segregant architecture of synergistic solute at theta '-Al2Cu/Al interface was guided by computational calculations and artificially realized at atomic scale to achieve an ultra-high thermal stability of theta '-Al2Cu, leading to a high creep resistance at 300 degrees C.
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