Effect of temperature and humidity conditioning on copper leadframe/mold compound interfacial delamination

Microelectronic packages continue to become smaller and more complex. Interfacial delamination is a common failure mechanism present in microelectronic packages due to the mismatch in the coefficient of thermal expansion (CTE) between different materials. Epoxy Molding Compound (EMC)/copper is a common interface found in microelectronic packages and is susceptible to delamination due to CTE mismatch. This work analyzes interfacial delamination of an EMC/copper interface and the impact of temperature and humidity conditioning on interfacial fracture energy using a double cantilever beam test. The critical interfacial fracture energy is obtained for as-received, thermally-aged, and humidity-conditioned samples. These experimental results can be used in models to predict delamination in an EMC/copper interface and how these interfaces are affected by factors such as time, temperature, and humidity conditioning.