Fracture resistance of hierarchical Cu-Mo nanocomposite thin films

The fracture behavior of high-temperature co-sputtered Cu/Mo nanocomposite thin films was investigated through in situ 3-point bend testing of pre-notched microbeams in SEM. The as-synthesized nanocomposites present hierarchical nano/microstructures composed of a matrix of phase-separated Cu-Mo with nanoscale ligaments dispersed with sub-micron scale Cu-rich islands containing Mo nano-precipitates. Results show a significant crack growth resistance in the hierarchical nanocomposite, several times higher than that measured in Cu/Mo nanoscale multilayers. Based on electron microscopy characterization, three mechanisms of crack growth resistance in the hierarchical structures are proposed: crack bridging by the Cu-rich layer, crack deflection via shear along the Cu/Mo interface, and multiple cracking. This work demonstrates an approach to increase toughness in high strength nanocomposites through interface micro-structure design.

Automated summary

The study investigates the fracture behavior of nanocomposite materials and finds that hierarchical structures exhibit crack growth resistance, leading to increased toughness. Electron microscopy characterization identifies three mechanisms of crack growth resistance in hierarchical structures: crack bridging, crack deflection, and multiple cracking.