期刊
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS
卷 31, 期 17, 页码 14681-14690出版社
SPRINGER
DOI: 10.1007/s10854-020-04031-0
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资金
- National Natural Science Foundation of China [51603015]
- Science Program of Beijing Municipal Education Commission [KM202010017002]
- Key Laboratory of Photochemical Conversion and Optoelectronic Materials, Technical Institute of Physics and Chemistry, Chinese Academy of Sciences [PCOM201918]
In this work, we prepared the epoxy-based adhesives with a binary filler system, which was composed of organosilicon modified hexagonal BN (h-BN) and alpha-Al2O3. H-BN platelets and alpha-Al2O3 nanoparticles were decorated by aminopropyl-trimethoxysilane (APTMS) and glycidylpropyltrimethoxysilane (GPTMS), respectively, to form covalent links to the filler/polymer matrix interface. The surface chemical composition was investigated by Fourrier transform infrared spectroscopy (FTIR) and thermogravimetry analysis (TGA), which demonstrated that the modifiers were successfully grafted onto the surface of fillers. This modification has been confirmed beneficial to thermal conductivity so that the thermal conductivity of adhesives incorporated with modified binary fillers could reach 0.85 w/m k, which is 10% more than specimen filled with unmodified fillers, because covalent links strengthened the interface and prohibited heat diffusion. Modified Hashin-Shtrikman model was utilized to analyze thermal resistance of the binary filler system, indicating that adhesives filled with modified fillers displayed lower thermal resistance. The enhancement of interface also brought about some other positive effect, especially in the decreasing of dielectric constant (< 4.3 at 1000 Hz) and the low values of dielectric loss tangent (10(-3)) and high electronic resistance (> 10(14)). Furthermore, the mechanical strength is significantly improved when the modified binary fillers were used.
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