期刊
COMPOSITES PART A-APPLIED SCIENCE AND MANUFACTURING
卷 135, 期 -, 页码 -出版社
ELSEVIER SCI LTD
DOI: 10.1016/j.compositesa.2020.105912
关键词
PP composites; Interfacial thermal resistance; 3D graphene network; Thermal conductivity
资金
- National Science Foundation of China [51703122]
- PetroChina Innovation Foundation [2016D-5007-0508]
- Natural Science Foundation of Shanghai [17ZR1440700]
- Development Fund for Shanghai Talents [2017014]
- State Key Laboratory of Solidification Processing in NWPU [SKLSP201837]
As an indispensable part of electronic devices, efficient thermal management materials can promote heat dissipation of electronic products quickly, thereby greatly improving their reliability, stability and service life. Here, a simple in-situ building approach was developed to fabricate highly thermally conducive polypropylene (PP)/graphene composites with three-dimensional graphene framework. Different from conventional filler modification, a unique matrix functionalization method, inspired by mussel, was carried out to form the interaction (hydrogen bonding and pi-pi conjugate) between PP and graphene, which greatly reduced interfacial thermal resistance. The obtained composite exhibits a quite high through-plane thermal conductivity (10.93 W.m(-1).K-1 , almost 55 times higher than that of pure PP), and shows excellent heat dissipation when used as a thermal management material in LED integration. The composite has the potential application in heat dissipation of high power and highly integrated electronic devices.
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