4.7 Article

A novel enhancement of shape/thermal stability and energy-storage capacity of phase change materials through the formation of composites with 3D porous (3,6)-connected metal-organic framework

期刊

CHEMICAL ENGINEERING JOURNAL
卷 389, 期 -, 页码 -

出版社

ELSEVIER SCIENCE SA
DOI: 10.1016/j.cej.2020.124430

关键词

Thermal energy storage; (3,6)-connected metal-organic framework; Shape-stable phase change materials

资金

  1. National Natural Science Foundation of China [51436001, 51572022]
  2. National Research Foundation of Korea (NRF) - Ministry of Science, ICT & Future Planning [2016R1E1A1A01940995]

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Leakage at temperatures above the melting point and thermal-transport performance are prime factors for the effective application of phase change materials (PCMs). In this study, a shape-stabilized composite PCM based on a three-dimensional (3D) porous (3,6)-connected metal-organic framework (MOF) and polyethylene glycol (PEG) was designed. The (3,6)-connected Zn2+ MOF gel was used as a porous supporting material, whereas PEG was employed as an energy-storage material. The PCM, which was impregnated by a capillary force and anchored by a weak hydrogen-bonding interaction between hydroxyl and amine groups, was stabilized by the supporting material. The 3D and two-fold interpenetrated structure of the MOF provided continuous heat-transfer paths in the composite PCM. The resulting composite material exhibited a high transition enthalpy (159.8 kJ/kg) with an encapsulation efficiency and impregnation ratio of 93.4% and 92.2%, respectively. The large interior surface accessibility of the MOF played a vital role in enhancing the thermal properties of the as-synthesized composite PCM. Additionally, the composite PCM exhibited excellent thermal stability and reliability even after 100 thermal cycles. Therefore, the composite PCM is a promising candidate for thermal-energy management systems owing to its high latent heat, suitable phase-change temperature, good chemical compatibility, reduced extent of supercooling, and high thermal stability.

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