Fabrication, microstructural characterization and mechanical properties evaluation of Ti/TiB/TiB2 composite coatings deposited on Ti6Al4V alloy by electro-spark deposition method

In this study, briquettes of Ti-TiB-TiB2 composite were produced by mixing Ti and B powders, performing self-propagating high-temperature synthesis process and by applying hydrostatic pressure on the reaction products with a high-capacity press. Ti-TiB-TiB2 was then coated to Ti6Al4V substrate by Electro-Spark Deposition (ESD) technique under two atmospheres of air and argon, single and double-layer coatings and in two energy levels of 40 W and 110 W as input powers. Coatings microstructure were examined by Scanning Electron Microscope (SEM) equipped with Energy Dispersive Spectroscopy (EDS) analyzer. Comparison of the coatings microstructure with the electrode microstructure shows that the coatings have a much finer microstructure than that of the electrode due mainly to the high solidification rate in the ESD process. Microstructural observations also revealed that the main phases in the coatings are needle-shaped TiB and particle-shaped TiB2 in the Ti matrix. The coating microstructure was much finer due to an increase in solidification rate by reducing the input power from 110 to 40 W. In such a situation, two phases of TiB2 and TiB with nanometer sizes were scattered in the Ti matrix. Also, due to the trapping of the gases in low input power of 40 W, a limited number of very small gas pores was created in the microstructure. Interface examination of the coating and the substrate by the Line Scan and X-ray Image show a good coherence of the coating with the substrate. Adhesion results showed that the bond strength between the coating and the substrate was higher than 50 MPa in all coatings. No crack was observed in the coatings after bending tests which were performed, in accordance with the intended standard, on the samples around a mandrel. The hardness of all coatings was increased with decreasing the input energy from 110 to 40 W.