期刊
APPLIED SURFACE SCIENCE
卷 514, 期 -, 页码 -出版社
ELSEVIER
DOI: 10.1016/j.apsusc.2020.145957
关键词
Electrochemical etching; GaN; CMP; Subsurface damage; Roughness
类别
资金
- research fund for Shenzhen Program from the Science and Technology Innovation Committee of Shenzhen Municipality, Shenzhen, China [GJHZ20180928155412525]
- Shenzhen Fundamental Research of Free Exploration from the Science and Technology Innovation Committee of Shenzhen Municipality, Shenzhen, China [JCYJ20180302174311087]
- Shenzhen High-level Innovation and Entrepreneurship Fund from the Science and Technology Innovation Committee of Shenzhen Municipality, Shenzhen, China [KQTD20170810110250357]
An electrochemical etching-enhanced CMP process was proposed to realize the highly efficient and damage-free finishing of GaN. In this process, electrochemical etching was first used to remove the damaged layer induced by grinding or lapping, and CMP was then conducted to flatten the etched surface. The etching rate could reach 1.46 mu m/min using NaOH solution as the electrolyte which was highly efficient. It was found that the etching rate and surface roughness can be balanced by adjusting the applied potential. CMP was carried out on an etched GaN sample and the surface roughness was reduced from 69.8 nm to 0.64 nm, and its surface quality was also confirmed to be desirable through photoluminescence. These results demonstrate that the proposed electrochemical etching-enhanced CMP process is highly effective and efficient to obtain a crack-free, damage-free and smooth GaN surface.
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