Three-Dimensional Photonic Crystal Bulks with Outstanding Mechanical Performance Assembled by Thermoforming-Etching Cross-linked Polymer Microspheres

Traditional self-assembly methods for photonic crystals (PCs) limited by poor mechanical performance and microstructure defects make it hard to be directly applied to optical devices, whose performance strongly rely on mechanical performance and microstructure of PCs. Here, a thermoforming-etching strategy combining both traditional processing and nanofabrication is reported to develop cross-linked polystyrene microsphere-based PC bulks with outstanding mechanical performance. It illustrates scientific principles, where surface molecular chains of PS microspheres were activated and entangled with each other under thermoforming conditions (200 degrees C; 220 MPa), resulting in applicable mechanical strength (hardness and modulus reach 0.12 and 4.12 GPa, respectively). The optimum optical reflectivity of the PS microsphere-based (180 nm) PC bulk is 49.4% at 381 nm. Furthermore, these PC bulks have been successfully written in anti-counterfeiting and realized colorful pattern printing. The innovative method opens a new route for the rapid and simple fabrication of the nanoparticle structure which can be used as various functional devices and directly promotes the industrialization of bulk PC devices, such as optical and display devices, and so forth.