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注意:仅列出部分参考文献,下载原文获取全部文献信息。Structure and properties of Sn-Cu lead-free solders in electronics packaging
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JOURNAL OF ALLOYS AND COMPOUNDS (2017)
Influence of Ce addition on Sn-3.0Ag-0.5Cu solder joints: Thermal behavior, microstructure and mechanical properties
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Microstructural and mechanical characterization of melt spun process Sn-3.5Ag and Sn-3.5Ag-xCu lead-free solders for low cost electronic assembly
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Temperature prediction for system in package assembly during the reflow soldering process
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Microstructure evolution, interfacial reaction and mechanical properties of lead-free solder bump prepared by induction heating method
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JOURNAL OF ALLOYS AND COMPOUNDS (2015)
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Properties and Microstructures of Sn-Ag-Cu-X Lead-Free Solder Joints in Electronic Packaging
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