期刊
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY
卷 10, 期 4, 页码 577-589出版社
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/TCPMT.2019.2948522
关键词
Computational fluid dynamics (CFD); energy-efficient; hotspot; targeted cooling; temperature uniformity
类别
资金
- imec
This article presents the design, fabrication, experimental characterization, and modeling analysis of the chip- level hotspot targeted liquid impingement jet cooling for high-power electronics. The hotspot targeted jet impingement cooling concept is successfully demonstrated with a chip-level jet impingement cooler with a 1-mm nozzle pitch and 300-mu m nozzle diameter fabricated using high-resolution stereolithography (additive manufacturing). The computational fluid dynamics (CFD) modeling and experimental analysis show that the improved hotspot targeted cooler design with fully open outlets can reduce the on-chip temperature difference by 70% compared with the full array cooler at the same pumping power of 0.03 W. The local heat transfer coefficient can achieve 15 x 10(4) W/m(2) K with a local flow rate per nozzle of 40 mL/min, requiring a pump power of 0.6 W. The benchmarking study proves that the hotspot targeted cooling is much more energy-efficient than uniform array cooling, with lower temperature difference and lower pump power.
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