期刊
SENSORS
卷 20, 期 9, 页码 -出版社
MDPI
DOI: 10.3390/s20092573
关键词
infrared sensor; thermopile; CMOS; MEMS; seebeck effect; crosstalk
资金
- EPSRC [EP/S031847/1]
- EPSRC [EP/S031847/1] Funding Source: UKRI
We present a new experimental technique to characterise the crosstalk of a thermopile-based thermal imager, based on bi-directional electrical heating of thermopile elements. The new technique provides a significantly simpler and more reliable method to determine the crosstalk, compared to a more complex experimental setup with a laser source. The technique is used to characterise a novel single-chip array, fabricated on a single dielectric membrane. We propose a theoretical model to simulate the crosstalk, which shows good agreement with the experimental results. Our results allow a better understanding of the thermal effects in these devices, which are at the center of a rising market of industrial and consumer applications.
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