期刊
JOURNAL OF MATERIALS ENGINEERING AND PERFORMANCE
卷 29, 期 4, 页码 2305-2315出版社
SPRINGER
DOI: 10.1007/s11665-020-04730-z
关键词
electrical resistivity; intermetallics; mulilayered SAC305 solderjoints; nonlinear ultrasonics testing; TLP soldering
资金
- DST-SERB, Govt. of India [SB/FTP/ETA-136/2012]
- JBNSTS, Kolkata
- Centre of Excellence in Advanced Materials at NIT Durgapur (MHRD, Govt. of India) [AC/MHRD/TEQIP-II/CoE/2013]
Transient liquid phase-like soldering technique has been successfully applied to prepare lead-free solder joints at 230 degrees C. Multiple interlayers of tin thin films in combination with a Sn-3.0Ag-0.5Cu (SAC305) solder paste have been used as filler for joining. Microstructural analysis was carried out by electron microscopy and energy-dispersive spectroscopy. For interlayer containing samples (Cu-Sn-SAC305-Sn-Cu), interfacial intermetallics layers found to be more homogeneous compared to the samples without interlayers (Cu-SAC305-Cu). Quality of the joints has been investigated nondestructively by ultrasonic method. On measuring the electrical resistivity by four-probe method, Cu-Sn-SAC305-Sn-Cu solder joint shows lower electrical resistivity compared to that of the Cu-SAC305-Cu solder joint, wherein nonlinear ultrasonic parameters confirm the superiority of former over later.
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