期刊
JOURNAL OF ELECTRONIC PACKAGING
卷 143, 期 1, 页码 -出版社
ASME
DOI: 10.1115/1.4046756
关键词
metal foam; heat sink; heat transfer; electronics cooling
资金
- National Natural Science Foundation of China [51676208]
- Fundamental Research Funds for the Central Universities [18CX07012A, 19CX05002A]
- Major Program of the Natural Science Foundation of Shandong Province [ZR2019ZD11]
This paper introduces a concept of metal foam heat sink with pin fins (MFPF heat sink) to improve the cooling performance of high-powered electronics with nonuniform heat flux. Numerical simulations show that the MFPF heat sink greatly enhances heat transfer performance due to improved flow distribution and enhanced overall effective thermal conductivity (ETC), leading to lower junction temperatures below 95 degrees C.
In this paper, a concept of metal foam heat sink with pin fins (MFPF heat sink) is proposed to improve the cooling performance of high-powered electronics with nonuniform heat flux. Numerical simulations are carried out to investigate the thermohydraulic performance of MFPF heat sink, and the metal foam (MF) heat sink and traditional pin fin (PF) heat sink are employed for comparison. The capability of MFPF heat sink in handling nonuniform heat flux is examined under different power levels. It indicates that the MFPF heat sink greatly enhances the heat transfer performance, due to the common effects of the improved flow distribution and enhanced overall effective thermal conductivity (ETC). Results also show that the MFPF heat sink promotes the improvement of the bottom wall temperature uniformity. Porosity has more pronounced effects on heat transfer performance of MFPF heat sink than pore density. A nonuniform distribution heat flux (15-80-15 W/cm(2)) can be successfully dissipated using the proposed MFPF heat sink with the junction temperature below 95 degrees C at Re of 500.
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