4.7 Article

Ar ion plasma surface modification on the heterostructured TaOx/InGaZnO thin films for flexible memristor synapse

期刊

JOURNAL OF ALLOYS AND COMPOUNDS
卷 822, 期 -, 页码 -

出版社

ELSEVIER SCIENCE SA
DOI: 10.1016/j.jallcom.2019.153625

关键词

Ar ions plasma; Surface modification; Heterostructure thin film; Flexible substrate; Synapse memristor

资金

  1. National Research Foundation of Korea (NRF) - Ministry of Education [NRF-2019R1F1A1057243]
  2. Future Semiconductor Device Technology Development Program - MOTIE (Ministry of Trade, Industry Energy) [20003808, 20004399]
  3. KSRC (Korea Semiconductor Research Consortium)
  4. Korea Evaluation Institute of Industrial Technology (KEIT) [20004399, 20003808] Funding Source: Korea Institute of Science & Technology Information (KISTI), National Science & Technology Information Service (NTIS)

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The enhanced resistive switching (RS) characteristics of the flexible TaOx/InGaZnO (IGZO)-based bilayer memristor deposited on the polyethylene terephthalate (PET) substrate are demonstrated in the Ti/TaOx/IGZO/Pt heterostructure. The Ar ion (Ar+) plasma treatment was intentionally induced on the surface of TaOx/IGZO thin films to improve RS filament consistency and results displayed the improved uniform RS behavior of the plasma-treated device. Further, this device is investigated as an artificial electronic synapse and important synaptic functions such as long term potentiation (LTP), long term depression (LTD), paired-pulse facilitation (PPF), post-tetanic potential (PTP) and spike-timing dependent plasticity (STDP) characteristics are well emulated and analogues to the biological synapse behavior. The bending test to assess influence of stress/strain induction on the RS properties is also demonstrated. Further, bulk and angle-resolved x-ray photoelectron spectroscopy (XPS) is utilized to shed a light on the influence of Ar+ plasma on the surface of TaOx/IGZO thin films, as well as AFM analysis, and this insight is argued in the elaborated RS mechanism discussion. (C) 2020 Elsevier B.V. All rights reserved.

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