4.7 Article

High hardness and fatigue resistance of CoCrFeMnNi high entropy alloy films with ultrahigh-density nanotwins

期刊

INTERNATIONAL JOURNAL OF PLASTICITY
卷 131, 期 -, 页码 -

出版社

PERGAMON-ELSEVIER SCIENCE LTD
DOI: 10.1016/j.ijplas.2020.102726

关键词

High entropy alloy films; Nanotwins; Nanoindentation dynamic mechanical analysis; Fatigue resistance; Hardness

资金

  1. Key Laboratory of Advanced Functional Materials of Jiangsu Province [JSLERS-2019-002]
  2. National Defense Pre-Research Foundation of China [41404020102]
  3. Ministry of Science and Technology, Taiwan [MOST 108-2218-E-002-062]

向作者/读者索取更多资源

Development of film materials has been limited by the hardness-fatigue resistance trade-off. The purpose of the present study was to obtain films with a combination of both high hardness and strong fatigue resistance. To achieve this, CoCrFeMnNi high entropy alloy films (HEAFs) were fabricated with three different structures: amorphous, high-density nanotwinned crystal structure with twin spacings of 2.2-5.6 nm, and ultrahigh-density nanotwinned columnar grains with twin spacings of 1.2-2.5 nm. Nanoindentation with dynamic mechanical analysis was used to measure the hardness and perform the fatigue tests. While higher twin densities could dissipate more energy by detwinning during fatigue loading to enhance the fatigue resistance, twin spacings larger than and small than 2 nm could, respectively, result in hardening and softening. Our results showed a high hardness of similar to 9 GPa and fair fatigue resistance (similar to 10(4) cycles) for both amorphous and high-density nanotwinned crystalline layers. For the ultrahigh-density nanotwinned columnar grain structure, a high hardness of similar to 8.5 GPa and an excellent fatigue resistance (similar to 10(6) cycles) were obtained. The outstanding fatigue resistance and high hardness were attributed to the synergistic effect of strain hardening and detwinning of ultrahigh-density nanotwins. The results not only enable CoCrFeMnNi HEAFs with a predominant combination of hardness and fatigue resistance, but also shed light on a new perspective for overcoming the conflict between hardness and fatigue resistance in film materials for microelectromechanical applications.

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