相关参考文献
注意:仅列出部分参考文献,下载原文获取全部文献信息。Stress analysis and structural optimization of 3-D IC package based on the Taguchi method
Ming-Yue Xiong et al.
SOLDERING & SURFACE MOUNT TECHNOLOGY (2020)
Inhibition of intermetallic compounds growth at Sn-58Bi/Cu interface bearing CuZnAl memory particles (2-6 μm)
Liang Zhang et al.
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS (2020)
Lead-free Sn-based/MW-CNTs nanocomposite soldering: effects of reinforcing content, Ni-coating modification, and isothermal ageing treatment
N. Shahamat Javid et al.
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS (2019)
Microstructure evolution and grain orientation of IMC in Cu-Sn TLP bonding solder joints
Lei Sun et al.
JOURNAL OF ALLOYS AND COMPOUNDS (2019)
Structure and properties of Sn-Cu lead-free solders in electronics packaging
Meng Zhao et al.
SCIENCE AND TECHNOLOGY OF ADVANCED MATERIALS (2019)
Influences of doping Ti nanoparticles on microstructure and properties of Sn58Bi solder
Nan Jiang et al.
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS (2019)
Reliability issues of lead-free solder joints in electronic devices
Nan Jiang et al.
SCIENCE AND TECHNOLOGY OF ADVANCED MATERIALS (2019)
Effect of CuZnAl particles addition on microstructure of Cu/Sn58Bi/Cu TLP bonding solder joints
Mingyue Xiong et al.
VACUUM (2019)
Influences of Mono-Ni(P) and Dual-Cu/Ni(P) Plating on the Interfacial Microstructure Evolution of Solder Joints
Zhe Zhang et al.
METALLURGICAL AND MATERIALS TRANSACTIONS A-PHYSICAL METALLURGY AND MATERIALS SCIENCE (2019)
Interfacial reaction and IMC growth between Sn-37 Pb and heterogeneous dual-phase substrate
Jinxuan Cheng et al.
VACUUM (2019)
Elevated-Temperature Mechanical Properties of Lead-Free Sn-0.7Cu-xSiC Nanocomposite Solders
A. Mohammadi et al.
JOURNAL OF ELECTRONIC MATERIALS (2018)
Nanocomposite SAC Solders: The Effect of Adding Ni and Ni-Sn Nanoparticles on Morphology and Mechanical Properties of Sn-3.0Ag-0.5Cu Solders
A. Yakymovych et al.
JOURNAL OF ELECTRONIC MATERIALS (2018)
Effects of nanoparticles on the thermal, microstructural and mechanical properties of novel Sn3.5Ag0.5Zn composite solders
C. L. Chuang et al.
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS (2018)
Materials, processing and reliability of low temperature bonding in 3D chip stacking
Liang Zhang et al.
JOURNAL OF ALLOYS AND COMPOUNDS (2018)
Effects of Metallic Nanoparticles on Interfacial Intermetallic Compounds in Tin-Based Solders for Microelectronic Packaging
A. S. M. A. Haseeb et al.
JOURNAL OF ELECTRONIC MATERIALS (2017)
Nanocomposite SAC solders: morphology, electrical and mechanical properties of Sn-3.8Ag-0.7Cu solders by adding Co nanoparticles
A. Yakymovych et al.
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS (2017)
Lead free Sn-Ag-Cu solders reinforced by Ni-coated graphene nanosheets prepared by mechanical alloying: Microstructural evolution and mechanical durability
F. Khodabakhshi et al.
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING (2017)
Effects of AlN Nanoparticles on the Microstructure, Solderability, and Mechanical Properties of Sn-Ag-Cu Solder
Do-Hyun Jung et al.
METALLURGICAL AND MATERIALS TRANSACTIONS A-PHYSICAL METALLURGY AND MATERIALS SCIENCE (2017)
Effects of CuZnAl Particles on Properties and Microstructure of Sn-58Bi Solder
Fan Yang et al.
MATERIALS (2017)
Cu6Sn5 Whiskers Precipitated in Sn3.0Ag0.5Cu/Cu Interconnection in Concentrator Silicon Solar Cells Solder Layer
Liang Zhang et al.
MATERIALS (2017)
Synthesis and characterization of ceramic nanoparticles reinforced lead-free solder
Zahra Fathian et al.
CERAMICS INTERNATIONAL (2017)
Thermal aging effects on microstructures and mechanical properties of an environmentally friendly eutectic tin-copper solder alloy
Asit Kumar Gain et al.
MATERIALS & DESIGN (2016)
Geometry effect on mechanical performance and fracture behavior of micro-scale ball grid array structure Cu/Sn-3.0Ag-0.5Cu/Cu solder joints
H. B. Qin et al.
MICROELECTRONICS RELIABILITY (2015)
In-situ alloying of Sn-3.5Ag solder during reflow through Zn nanoparticle addition and its effects on interfacial intermetallic layers
A. S. M. A. Haseeb et al.
INTERMETALLICS (2014)
Transition from flip chip solder joint to 3D IC microbump: Its effect on microstructure anisotropy
K. N. Tu et al.
MICROELECTRONICS RELIABILITY (2013)
Bumpless interconnect of 6-μm-pitch Cu electrodes at room, temperature
Akitsu Shigetou et al.
IEEE TRANSACTIONS ON ADVANCED PACKAGING (2008)