4.6 Article

Resilience of Fluorinated Indium-Gallium-Zinc Oxide Thin-Film Transistor Against Hydrogen-Induced Degradation

期刊

IEEE ELECTRON DEVICE LETTERS
卷 41, 期 5, 页码 729-732

出版社

IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/LED.2020.2983789

关键词

Thin film transistors; Sulfur hexafluoride; Silicon; Aluminum oxide; Resilience; Plasmas; Hydrogen; Fluorination; hydrogen; indium-gallium-zinc oxide; integration; thin-film transistors

资金

  1. State Key Laboratory of Advanced Displays and Optoelectronics Technologies [ITC-PSKL12EG02]
  2. Shenzhen Science and Technology Innovation Committee [SGDX2019081623360954]

向作者/读者索取更多资源

Thin-film transistors (TFTs) based on amorphous indium-gallium-zinc oxide (IGZO) with or without plasma fluorination treatment were fabricated and the sensitivity of their characteristics to hydrogen exposure was compared. Consistent with the lower hydrogen content revealed using secondary ion-mass spectrometry, TFTs built with fluorinated IGZO were shown to exhibit improved intrinsic resilience against hydrogen-induced degradation. Further enhanced by the incorporation of aluminum oxide as a hydrogen diffusion-barrier, such resilience is beneficial to the integration of fluorinated IGZO TFTs with hydrogen-containing devices, such as photodiodes based on amorphous hydrogenated silicon and TFTs based on low-temperature polycrystalline silicon.

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