期刊
ELECTRONICS
卷 9, 期 2, 页码 -出版社
MDPI
DOI: 10.3390/electronics9020238
关键词
system-in-foil; flexible interposer; chip embedding; embedding in flex; fatigue reliability; flip-chip; ultra-thin silicon; chip-on-foil; thin metal film
资金
- H2020 Framework of the European Union [692482]
- Bundesministerium fur Bildung und Forschung (BMBF) [16ESE0088]
The growing interest towards thinner and conformable electronic systems has attracted significant attention towards flexible hybrid electronics (FHE). Thin chip-foil packages fabricated by integrating ultra-thin monocrystalline silicon integrated circuits (ICs) on/in flexible foils have the potential to deliver high performance electrical functionalities at very low power requirements while being mechanically flexible. However, only very limited information is available regarding the fatigue or dynamic bending reliability of such chip-foil packages. This paper reports a series of experiments where the influence of the type of metal constituting the interconnects on the foil substrates on their dynamic bending reliability has been analyzed. The test results show that chip-foil packages with interconnects fabricated from a highly flexible metal like gold endure the repeated bending tests better than chip-foil packages with stiffer interconnects fabricated from copper or aluminum. We conclude that further analysis work in this field will lead to new technical concepts and designs for reliable foil based electronics.
作者
我是这篇论文的作者
点击您的名字以认领此论文并将其添加到您的个人资料中。
推荐
暂无数据