期刊
ADVANCED MATERIALS TECHNOLOGIES
卷 5, 期 1, 页码 -出版社
WILEY
DOI: 10.1002/admt.201900752
关键词
near-infrared imaging; perovskites; photodetectors; photodiodes; transistors
资金
- National Key Research and Development Program of China [2016YFA0202002]
- National Natural Science Foundation of China [61974006]
- Guangdong Natural Science Foundation [2018A030313332]
- Shenzhen Science and Technology Innovation Commission [JCYJ20160229122349365]
Flat-panel imagers have wide applications in industrial and medical inspections. Nonetheless, large area infrared imaging remains a challenge due to the fact that the state-of-the-art infrared sensors are usually based on silicon or germanium technologies, which are limited by the wafer size. Recent advances in low bandgap Sn-Pb perovskite photodiodes (PDs) and indium gallium zinc oxide (IGZO) thin-film transistors (TFTs) matrix backplane bring new opportunity for developing the large area near-infrared image sensor. As a proof of concept, a 12 x 12 pixels array with each pixel independently controlled by the gate voltage of a TFT are constructed. Arrays of Sn-Pb based perovskite PDs are spin deposited onto the IGZO TFT drain electrode via self-assembled patterning process. The low bandgap perovskite PD exhibits a broad spectral response for wavelength from 300 to 1000 nm, featuring a high light to the dark current ratio of approximate to 10(4), and a high specific detectivity (D*) of approximate to 10(11) Jones at 850 nm (biased at -0.1 V). The integration takes advantage of the high mobility of IGZO transistors and the high infrared sensitivity of low Sn-Pb perovskite materials, which enables the next generation near-infrared flat-panel imager with high frame rate and low operating voltages.
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