Controlling Light- and Elevated-Temperature-Induced Degradation With Thin Film Barrier Layers

In this article, we investigate the extent of lifetime degradation attributed to light- and elevated-temperature-induced degradation (LeTID) in p-type multicrystalline silicon wafers passivated with different configurations of hydrogenated silicon nitride (SiNx:H) and aluminum oxide (AlOx:H). We also demonstrate a significant difference between AlOx:H layers grown by atomic layer deposition (ALD) and plasma-enhanced chemical vapor deposition (PECVD) with respect to the extent of LeTID. When ALD AlOx:H is placed underneath a PECVD SiNx:H layer, as used in a passivated emitter and rear solar cell, a lower extent of LeTID is observed compared with the case when a single PECVD SiNx:H layer is used. On the other hand, the LeTID extent is significantly increased when an ALD AlOx:H is grown on top of the PECVD SiNx:H film. Remarkably, when a PECVD AlOx:H is used underneath the PECVD SiNx:H film, an increase in the LeTID extent is observed. Building on our current understanding of LeTID, we explain these results with the role of ALD AlOx:H in impeding the hydrogen diffusion from the dielectric stack into the c-Si bulk, while PECVD AlOx:H seems to act as an additional hydrogen source. These observations support the hypothesis that hydrogen is playing a key role in LeTID and provide solar cell manufacturers with a new method to reduce LeTID in their solar cells.