期刊
SCIENTIFIC REPORTS
卷 9, 期 -, 页码 -出版社
NATURE PUBLISHING GROUP
DOI: 10.1038/s41598-019-56292-3
关键词
-
资金
- Ministry of Science and Technology [MOST 107-2221-E-009-117-MY3, 108-2218-E-009-031, 108-3017-F-009-004]
- Center for Emergent Functional Matter Science of National Chiao Tung University from The Featured Areas Research Center Program by the Ministry of Education in Taiwan
Self-heating effect is a major limitation in achieving the full performance potential of high power GaN power devices. In this work, we reported a micro-trench structure fabricated on the silicon substrate of an AlGaN/GaN high electron mobility transistor (HEMT) via deep reactive ion etching, which was subsequently filled with high thermal conductive material, copper using the electroplating process. From the current-voltage characteristics, the saturation drain current was improved by approximately 17% with the copper filled micro-trench structure due to efficient heat dissipation. The I-DS difference between the pulse and DC bias measurement was about 21% at high bias V-DS due to the self-heating effect. In contrast, the difference was reduced to approximately 8% for the devices with the implementation of the proposed structure. Using Micro-Raman thermometry, we showed that temperature near the drain edge of the channel can be lowered by approximately similar to 22 degrees C in a HEMT operating at similar to 10.6 Wmm(-1) after the implementation of the trench structure. An effective method for the improvement of thermal management to enhance the performance of GaN-on-Silicon HEMTs was demonstrated.
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