期刊
MATERIALS
卷 13, 期 4, 页码 -出版社
MDPI
DOI: 10.3390/ma13040968
关键词
tin pest; recrystallization; grain size; beta to alpha-Sn allotrope transition; SnAgCu (SAC); electrical resistance measurement
类别
资金
- National Research, Development, and Innovation Office of Hungary-NKFIH [FK 127970]
- Higher Education Excellence Program of the Ministry of Human Capacities, Nanotechnology and Materials Science research area of Budapest University of Technology and Economics (BME FIKP-NAT) Hungary
The effect of recrystallization of 99.3Sn-0.7Cu wt. % solder alloy on the allotropic transition of beta to alpha-Sn (so-called tin pest phenomenon) was investigated. Bulk samples were prepared, and an InSb inoculator was mechanically applied to their surfaces to enhance the transition. Half of the samples were used as the reference material and the other half were annealed at 180 degrees C for 72 h, which caused the recrystallization of the alloy. The samples were stored at -10 and -20 degrees C. The beta-Sn to alpha-Sn transition was monitored using electrical resistance measurements. The expansion and separation of the tin grains during the beta-Sn to alpha-Sn transition process were studied using scanning electron microscopy. The recrystallization of the alloy suppressed the tin pest phenomenon considerably since it decreased the number of defects in the crystal structure where heterogeneous nucleation of beta-Sn to alpha-Sn transition could occur. In the case of InSb inoculation, the spreading of the transition towards the bulk was as fast as the spreading parallel to the surface of the sample.
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