4.7 Article

Interaction of lateral cracks in double scratching of single-crystal silicon carbide

期刊

出版社

ELSEVIER
DOI: 10.1016/j.tafmec.2019.102378

关键词

Double scratching; Lateral cracks; Stress intensity factors; Single-crystal silicon carbide

资金

  1. National Natural Science Foundation of China [51775317]
  2. Key Research and Development Program of Shandong Province, China [2019GGX104007, 2018GGX103039, 2017GGX30142]

向作者/读者索取更多资源

In this paper, a new method is established to analyze the interaction of lateral cracks in double scratching process, which is a basic problem in machining of single-crystal silicon carbide. Applying superposition principle, this interaction problem is reduced to the calculation of stress intensity factors (SIFs) around two scratching-induced collinear cracks under scratching-induced stress field. First, values of SIFs at crack tips under the scratching-induced stress field are obtained applying Fourier transformation, gap functions of displacements and Jacobi polynomials. Then, the scratching-induced stress filed is obtained by the superposition of Boussinesq field, Cerruti field and Blister stress field. Finally, this calculation method is verified by comparing with the results in literature in special case. It is found that values of SIFs decrease dramatically when scratching separation distance increases. The interaction effect can be neglected when the separation distance is larger than 1.6 times of the length of lateral cracks generated in single scratching.

作者

我是这篇论文的作者
点击您的名字以认领此论文并将其添加到您的个人资料中。

评论

主要评分

4.7
评分不足

次要评分

新颖性
-
重要性
-
科学严谨性
-
评价这篇论文

推荐

暂无数据
暂无数据