Controllable embedding of size-selected copper nanoparticles into polymer films

The ability to control the extent of metal nanoparticle (NP) embedding into polymer films has attracted attention for applications in quite a few research branches. In this study, the behavior of size-selected copper NPs produced by the gas aggregation method and deposited on poly(methyl methacrylate) and polystyrene films is studied under thermal annealing above and below the glass transition temperature. Several important tendencies of the embedding dynamics in terms of dependence on NP size, annealing temperature, and time, as well as the type of polymer, are found and analyzed. Physical models explaining particle behavior and allowing the elaboration of practical recommendations on the controllable embedding of metal NPs into polymer films are suggested.