期刊
JOURNAL OF NUCLEAR MATERIALS
卷 529, 期 -, 页码 -出版社
ELSEVIER
DOI: 10.1016/j.jnucmat.2019.151931
关键词
Thermal conductivity; Phonon and electron scatterings; Dislocation; Grain size; Solute
资金
- National MCF Energy RD Program [2018YFE0308100, 2018YFE0308105]
- National Natural Science Foundation of China [11905025]
- Supercomputing Center of Dalian University of Technology
Tungsten (W) and tungsten-rhenium (W-Re) alloys are considered as the preferred plasma facing materials and structure materials for advanced fusion reactors. Thermal conductivity is one of the critical concerns for their materials applications. Although the steady-state heat transfer model can be utilized to evaluate the thermal conductivity variation in a traditional way, the thermal parameters of the material must be known beforehand. However, there are rare studies on the role of phonon and electron scattering mechanisms over a wide temperature range during the thermal transport process. In this paper, a physics-based model is established to predict the thermal conductivities of pristine W and W-xRe alloys (x = 1, 3, 5, 10, 25 wt%) from 300 to 1200 K. The model, which contains various scattering mechanisms, can be used to assess the effects of dislocation, grain size and solute rhenium on the total thermal conductivity. The temperature-dependent thermal conductivity predicted by the physics-based model agrees well with the reported data. Our simulation results reveal that 10(10) - 10(13) m(-2) dislocation densities in tungsten has almost no impact on the change of thermal conductivity, while an obvious decrease is observed at temperature below 400 K if dislocation density exceeds 10(14) M-2. Both small grain size and more solute rhenium in W-Re alloy can severely degrade the ability of heat transport. (C) 2019 Elsevier B.V. All rights reserved.
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