相关参考文献
注意：仅列出部分参考文献，下载原文获取全部文献信息。Wettability, interfacial reactions, and impact strength of Sn-3.0Ag-0.5Cu solder/ENIG substrate used for fluxless soldering under formic acid atmosphere
Siliang He et al.
JOURNAL OF MATERIALS SCIENCE (2020)
Effect of extreme thermal shocking on the reliability of Sn50Pb49Sb1/Cu solder joint
Jianhao Wang et al.
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS (2020)
In-situ observation of fluxless soldering of Sn-3.0Ag-0.5Cu/Cu under a formic acid atmosphere
Siliang He et al.
MATERIALS CHEMISTRY AND PHYSICS (2020)
Brittle fracture induced by phase transformation of Ni-Cu-Sn intermetallic compounds in Sn-3Ag-0.5Cu/Ni solder joints under extreme temperature environment
Ruyu Tian et al.
JOURNAL OF ALLOYS AND COMPOUNDS (2019)
Microstructure and performance evolution of SnPbSb solder joint under -ray irradiation and thermal cycling
Jianhao Wang et al.
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS (2019)
Microstructure, IMCs layer and reliability of Sn-58Bi solder joint reinforced by Mo nanoparticles during thermal cycling
Li Yang et al.
MATERIALS CHARACTERIZATION (2019)
Effect of Thermal Cycling on Interfacial Microstructure and Mechanical Properties of Sn-0.3Ag-0.7Cu-(-Al2O3) Nanoparticles/Cu Low-Ag Solder Joints
Jie Wu et al.
JOURNAL OF ELECTRONIC MATERIALS (2019)
The reliability of lead-free solder joint subjected to special environment: a review
Jianhao Wang et al.
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS (2019)
Suppressed Growth of (Fe, Cr, Co, Ni, Cu)Sn2 Intermetallic Compound at Interface between Sn-3.0Ag-0.5Cu Solder and FeCoNiCrCu0.5 Substrate during Solid-state Aging
Yu-An Shen et al.
SCIENTIFIC REPORTS (2019)
Sn-3.0Ag-0.5Cu/Sn-58Bi composite solder joint assembled using a low-temperature reflow process for PoP technology
Yu-An Shen et al.
MATERIALS & DESIGN (2019)
Effect of FeCoNiCrCu0.5 High-entropy-alloy Substrate on Sn Grain Size in Sn-3.0Ag-0.5Cu Solder
Yu-An Shen et al.
SCIENTIFIC REPORTS (2019)
Growth behavior of intermetallic compounds and early formation of cracks in Sn-3Ag-0.5Cu solder joints under extreme temperature thermal shock
Ruyu Tian et al.
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING (2018)
Study on the Reliability of Sn50Pb49Sb1/Cu Solder Joints Subjected to γ-ray Irradiation
Jianhao Wang et al.
APPLIED SCIENCES-BASEL (2018)
Effect of gamma-ray irradiation on microstructure and mechanical property of Sn63Pb37 solder joints
Jianhao Wang et al.
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS (2018)
Influence of Interfacial Intermetallic Growth on the Mechanical Properties of Sn-37Pb Solder Joints under Extreme Temperature Thermal Shock
Chunjin Hang et al.
APPLIED SCIENCES-BASEL (2018)
Thermal cycling, shear and insulating characteristics of epoxy embedded Sn-3.0Ag-0.5Cu (SAC305) solder paste for automotive applications
Ashutosh Sharma et al.
JOURNAL OF ALLOYS AND COMPOUNDS (2017)
Study on the microstructure and properties of low-Ag Sn-0.3Ag-0.7Cu-0.5Ga solder alloys bearing Pr
He Wang et al.
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS (2017)
The influence of strengthening and recrystallization to the cracking behavior of Ni, Sb, Bi alloyed SnAgCu solder during thermal cycling
Ying Zhong et al.
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING (2016)
Non-Orthogonal Multiple Access for 5G: Solutions, Challenges, Opportunities, and Future Research Trends
Linglong Dai et al.
IEEE COMMUNICATIONS MAGAZINE (2015)
Formation and growth of intermetallic compound layers at the interface during laser soldering using Sn-Ag Cu solder on a Cu Pad
Hiroshi Nishikawa et al.
JOURNAL OF MATERIALS PROCESSING TECHNOLOGY (2015)
The tensile impact properties of aged Sn-3Ag-0.5Cu/Cu solder joints
Van Luong Nguyen et al.
MICROELECTRONICS RELIABILITY (2015)
Formation of compounds and Kirkendall vacancy in the Cu-Sn system
O. Minho et al.
MICROELECTRONIC ENGINEERING (2014)
Impact strength of Sn-3.0Ag-0.5Cu solder bumps during isothermal aging
JianXin Wang et al.
MICROELECTRONICS RELIABILITY (2014)
The coupling effects of thermal cycling and high current density on Sn58Bi solder joints
Yong Zuo et al.
JOURNAL OF MATERIALS SCIENCE (2013)
Interfacial reaction and shear strength of Ni-coated carbon nanotubes reinforced Sn-Ag-Cu solder joints during thermal cycling
Y. D. Han et al.
INTERMETALLICS (2012)
Characterization of IMC layer and its effect on thermomechanical fatigue life of Sn-3.8Ag-0.7Cu solder joints
F. X. Che et al.
JOURNAL OF ALLOYS AND COMPOUNDS (2012)
Effect of Isothermal Aging and Thermal Cycling on Interfacial IMC Growth and Fracture Behavior of SnAgCu/Cu Joints
Xiaoyan Li et al.
JOURNAL OF ELECTRONIC MATERIALS (2011)
Effects of bump size on deformation and fracture behavior of Sn3.0Ag0.5Cu/Cu solder joints during shear testing
Yanhong Tian et al.
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING (2011)
Spalling behavior of interfacial intermetallic compounds in Pb-free solder joints subjected to temperature cycling loading
J. W. Ronnie Teo et al.
ACTA MATERIALIA (2008)
Impact of thermal cycling on Sn-Ag-Cu solder joints and board-level drop reliability
Luhua Xu et al.
JOURNAL OF ELECTRONIC MATERIALS (2008)
On the difference between thermal cycling and thermal shock testing for board level reliability of soldered interconnections
J. W. C. de Vries et al.
MICROELECTRONICS RELIABILITY (2007)
Shear strength and interfacial microstructure of Sn-Ag-xNi/Cu single shear lap solder joints
Yang-Hsien Lee et al.
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING (2007)
Temperature profile effects in accelerated thermal cycling of SnPb and Pb-free solder joints
Y Qi et al.
MICROELECTRONICS RELIABILITY (2006)
The impact of thermal cycling regime on the shear strength of lead-free solder joints
M Dusek et al.
SOLDERING & SURFACE MOUNT TECHNOLOGY (2005)
Influence of interfacial intermetallic compound on fracture behavior of solder joints
HT Lee et al.
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING (2003)
Space environments and induced damage mechanisms in materials
G Pippin
PROGRESS IN ORGANIC COATINGS (2003)
分享论文
