期刊
JOURNAL OF ELECTRONIC MATERIALS
卷 49, 期 3, 页码 1749-1764出版社
SPRINGER
DOI: 10.1007/s11664-019-07908-x
关键词
Thermal conductivity; EMI shielding; hybrid filler; polymer composite
Polymer composites have been a material of choice for lightweight and durable applications in sectors ranging from automobile, packaging, structural components, and electronics to energy harvesting. Their versatility and ability to be tailored to application requirements have made them prospective alternatives for metal enclosures used in communication systems, power electronics, electric motors, and generators. The easy processing and high strength-to-weight ratio provide advantages over traditional materials that involve time- and-labor intensive processes. However, high thermal conductivity (TC) and electromagnetic interference (EMI) shielding are factors limiting their penetration into niche markets, and thus the development of alternatives with high TC and EMI shielding efficiency is critical. Thermally conductive polymer composites and EMI shielding effectiveness (SE) is a current issue in different applications including polymers providing light weight, corrosion resistance, and ease of processing as compared with metal. This paper focuses on improvements in the TC and shielding effectiveness of polymers by incorporating various fillers including carbon-based, mineral-based, and hybrid fillers. The paper reviews the current research worldwide regarding the enhancement of the TC and shielding effectiveness of polymer composites.
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