期刊
INTERNATIONAL JOURNAL OF THERMAL SCIENCES
卷 147, 期 -, 页码 -出版社
ELSEVIER FRANCE-EDITIONS SCIENTIFIQUES MEDICALES ELSEVIER
DOI: 10.1016/j.ijthermalsci.2019.106120
关键词
MCM-BGA 3D package; Heat transfer performance; Thermal stress; Structural parameters optimization
资金
- National Natural Science Foundation of China [51676208, 51906257]
- Fundamental Research Funds for the Central Universities [18CX07012A, 19CX05002A]
- China Postdoctoral Science Foundation [2018M642724]
The multi-core technology promotes the efficiency improvement of microelectronic devices. However, the increasing power and heat flux lead to heat dissipation problems on hotspots, which severely affects the performance of electronic devices and impedes the development of electronic techniques. Therefore, thermal management suitable for electronic packaging is crucial. In this paper, a multi-chips module combined with ball grid array (MCM-BGA) 3D package model was established; the thermal interface resistance between the microchannel heat sink and heat spreader was considered; the flow heat transfer as well as thermal stress performance of the model were discussed. The results indicate that the MCM-BGA 3D package model can maintain the maximum temperature and thermal stress in a satisfactory range. However, the major concentration areas of the maximum temperature are the chips and solder balls, especially the welding spots. Based on the analysis, the multi-parameters optimization of structural parameters was conducted. After the optimization, the maximum temperature and thermal stress decrease by 5 K and 20% in average, respectively. The optimal thickness of thermal interface material, heat spreader and substrate are 0.1 mm, 1.2 mm and 1.2 mm, respectively.
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