期刊
INTERNATIONAL JOURNAL OF REFRACTORY METALS & HARD MATERIALS
卷 87, 期 -, 页码 -出版社
ELSEVIER SCI LTD
DOI: 10.1016/j.ijrmhm.2019.105135
关键词
Additive manufacturing; Thermal conductivity; Tungsten; Hot isostatic pressing; Microstructure
资金
- National Magnetic Confinement Fusion Science Program of China [2014GB117000]
- National Natural Science Foundation of China [U1605243]
The crack-healing behaviors and microstructure evolution of pure tungsten produced by laser powder bed fusion (LPBF) were studied and compared before and after post hot isostatic pressing (post-HIP) treatment. An average thermal conductivity of 133 W.m(-1).K-1 at room temperature (RT) was obtained after HIP, which was 16% higher than that of as-built sample (115 W.m(-1).K-1). Although the HIP process had little effect on density, it resulted in a large grain size of > 300 mu m accompanied by a decrease in dislocation density and crack healing, which led to a substantial improvement of thermal conductivity of pure tungsten. The positive correlation between relative density and thermal conductivity of as-built tungsten was reported.
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