An experimental approach to investigate thermal performance of paraffin wax and 1-hexadecanol based heat sinks for cooling of electronic system

The efficiency and life span of an electronic device or system depends on its operating temperature. Longer operation period in elevated temperatures leads to system failure. In addition, miniaturization of electronic device and generation of high energy density are the current trend in this field. Therefore, an efficient cooling system is vital for ensuring this system operates in optimum temperature. Integration of heat sinks together with phase change material (PCM) can be adapted to dissipate heat generation by electronic system. This study intends to investigate thermal performance of various configuration of cross-fin heat sinks with and without PCM. Two types of PCMs considered are paraffin wax and 1-hexadecanol. The study implies that addition of fins and PCM capable of augmented thermal performance of the heat sinks. Higher number of cross-fin and amount of PCM led to lower heat sinks base temperature. The base temperature of heat sinks with cross-fin (16 square cavities) fully added with paraffin wax is 46.9 degrees C compared to 51.6 degrees C observed for similar heat sinks without paraffin wax. Heat sinks filled with paraffin wax performed better than heat sinks filled with 1-hexadecanol. This translates to lower base heat sinks temperature especially at the mid-region of the test period.